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 Researchers from Northwestern

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Posts : 48
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Join date : 2010-08-16

PostSubject: Researchers from Northwestern    Tue Sep 21, 2010 8:08 pm

Researchers from Northwestern University and the University of Illinois at Urbana-Champaign designed a clever square polymer stamp that allows them to vary its adhesion strength. The stamp can easily pick up an array of electronic devices from a silicon surface and move and print them on a curved surface.







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